Qualcomm Snapdragon 810 vs MediaTek MT6795 Helio X10 – specs, benchmark results and temperatures


Mediatek MT6795 Helio X10 is one of the top SoCs from the manufacturer and is even said to be one of the frightful competitors to Qualcomm’s mobile chips. We put that to the test to see if that is really true, so we decided to compare the Snapdragon 810 and Mediatek MT6795 Helio X10. For the purposes of this comparison we used Sony Xperia Z3+ and Meizu MX5. We’ve put their specs sheets and benchmark results from various computing and graphics performance tests, as well as information about their temperatures, side by side.

If you are interested in the prices of Sony Xperia Z3+ and Meizu MX5 you can check them at the following links:

Sony Xperia Z3+: http://amzn.to/1KE9GVJ

Meizu MX5: http://amzn.to/1MscCYc

Specs sheet

Qualcomm Snapdragon 810
Manufacturing process 20 nm
Cores 8
Clocked frequency 1.5 – 2.0 GHz
Architecture ARM Cortex-A53 + Cortex-A57/ 64-bit support
GPU Adreno 430

Mediatek MT6795 Helio X10
Manufacturing process 28 nm
Cores 8
Clocked frequency 2.2 GHz
Architecture Cortex-A53 / 64-bit support
GPU PowerVR G6200

Mediatek MT6795 Helio X10 is a 64-bit SoC, with 28nm manufacturing process. It boasts eight Cortex-A53 cores clocked at 2.16GHz. The mobile chip supports MediaTek’s CorePilot technology that allows all of the 8 cores to work at their maximum capability when needed and thus boosts the overall performance even further. Not only that, but it also helps lower the energy consumption and according to MediaTek keeps lower outer temperatures. To the list of features we can add Wi-Fi 802.11ac, Bluetooth, FM, GPS, Glonass, Beidou and support for displays with 1660 x 2560 resolution. PowerVR G6200 is the GPU unit that takes care of the graphic performance of the device.

You can find more information about the SoC and its capabilities in MediaTek’s official Web page:

Snapdragon 810 is a top-tier SoC from Qualcomm with 64-bit architecture and 20nm manufacturing process. The mobile chip has eight cores separated into two clusters. The first four are Cortex-A53, clocked at 1.5GHz and they take care of light tasks, which don’t require high performance, resulting in lower energy consumption. The other four are more powerful Cortex-A57, clocked at 2.00GHz. They deal with heavier, more demanding apps and tasks. The SoC also supports 4K video recording and playback capabilities, Wi-Fi 802.11 n/ac, LTE Cat 9 with up to 450Mbps speed, Bluetooth 4.1, as well as support for the Quick Charge 2.0 technology. The GPU in the chip is Adreno 430 that also provides high graphics performance.

You can find more information about the SoC and its capabilities in Qualcomm’s official website:

Benchmark results

Both SoCs are without any doubt two of the most powerful units currently on the market. There is no way to compare them without taking a look at results from synthetic benchmark tests. Here’s how they stack against each other when it comes to graphic and computing power.

Benchmarks Qualcomm Snapdragon 810 Mediatek MT6795 Helio X10
Geekbench 3 (Multi-Core) 3650 4786
Vellamo 2 Metal 1387 983
GFXBench 2.7 T-Rex (offscreen) 45 24
GFXBench 3 Manhattan (offscreen) 23 9.1
3D Mark Ice Unlimited 24005 16417
Pi – 10 mil. (lower is better) 24,278 34.028


The rumor about Snapdragon 810 overheating started as soon as the first devices with the SoC starting popping out on the market. We measured the outer temperatures of both Xperia Z3+ and Meizu MX5 to see how hot do they get after a couple of hours of 3D gaming. The SoC inside a device isn’t the only factor, which affects outer temperatures, but the difference is clear. You can see the results below.



Sony Xperia Z3+: http://amzn.to/1KE9GVJ

Meizu MX5: http://amzn.to/1MscCYc

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