How to open HP 250 G10 – disassembly and upgrade options


Step 1: Accessing the Internal Components

  1. Ensure the HP 250 G10 is powered off and placed on a soft, clean surface to prevent scratches or damage.
  2. Remove the four Phillips-head screws from the bottom of the laptop.
  3. Begin popping the bottom panel off, starting from the front, then continue working your way around the sides and the back.

Hint: Proceed with caution to avoid damaging the internal clips or the laptop casing.


Step 2: Removing the Battery

  1. Wear gloves to avoid short circuits and carefully disconnect the built-in battery connector.
  2. Remove the five Phillips-head screws securing the battery to the laptop’s chassis, then lift the 41Wh battery away from the device.
  3. Untangle the speaker cables from the battery housing to completely free the battery.

Caution: Handle the battery and its connector with care to avoid any damage.

More info: The 41Wh battery offers up to 8 hours and 20 minutes of web browsing or 7 hours and 42 minutes of video playback, providing reliable battery life for daily tasks.


Memory Upgrade

  1. Locate the two SODIMM slots available for memory upgrades.
  2. Install up to 32GB of DDR4-3200 MHz RAM in dual-channel mode to enhance the laptop’s multitasking capabilities and performance.

Hint: Dual-channel configuration maximizes the performance potential of the installed memory.

You can buy DDR4 RAM modules here: Buy from Flipkart.com


Storage Upgrade

  1. Identify the single M.2 slot compatible with Gen 4 SSDs on the motherboard.
  2. Upgrade the storage by installing a new NVMe SSD, utilizing the thin cooling pad under the preinstalled NVMe for optimal thermal management.
  3. Choose and purchase a new drive when needed. Don’t forget to check out our Top M.2 SSDs Performance Rankings.

You can buy Gen 4 M.2 SSD modules here: Buy from Flipkart.com


Examining the Cooling System

Review the cooling system, which includes one fan, a heat pipe, one top-mounted heat sink, and a heat spreader, designed to efficiently manage the thermal output of the device.

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