How to open MSI Thin GF63 (12Vx) – disassembly and upgrade options

Ensure the MSI Thin GF63 (12Vx) is powered off and placed on a soft, clean surface to prevent scratches or damage.
Remove the 12 Phillips-head screws from the bottom of the laptop.
Begin the prying process from the front of the device, carefully working your way around, and leave the back side for the end.
Flip the laptop to pop up the small cap behind the lid, then use a plastic tool to pry the last section.

Hint: Proceed with caution to avoid damaging the internal clips or the laptop casing.

Step 2: Removing the Battery

Attempt to gently unglue the 52.4Wh battery starting from its left side due to the extra sticky double-sided tape used by MSI.
Be extremely careful around the touchpad area to avoid any potential damage while ungluing the battery.
Once loosened, carefully disconnect the battery connector from the motherboard.

Caution: The battery is glued to the chassis, making removal challenging. Proceed gently to avoid damaging the battery or nearby components.

More info: The 52.4Wh battery provides up to 6 hours and 40 minutes of web browsing or 6 hours and 15 minutes of video playback, a satisfactory performance for its capacity.

Memory Upgrade

Locate the two SODIMM slots for memory upgrades, allowing up to 64GB of DDR4-3200MHz memory in dual-channel.
Upgrading the memory can significantly enhance the laptop’s multitasking capabilities and overall performance.

You can buy DDR4 RAM modules here: Buy from Amazon.com (#CommissionsEarned)

Storage Upgrade

Identify the M.2 slot compatible with Gen 4 SSDs for a high-speed storage upgrade, in addition to a SATA slot for additional SSDs or HDDs.

Hint: Don’t forget to check out our Top M.2 SSDs Performance Rankings to choose and purchase a new drive when needed.

You can buy Gen 4 M.2 SSD modules here: Buy from Amazon.com (#CommissionsEarned)

Examining the Cooling System

Inspect the cooling system, which includes a single fan, heat pipes shared between the CPU and GPU and one more dedicated to each chip, two heat sinks, a metal plate over the graphics memory and VRMs, and two heat spreaders.