How to open HP ZBook Fury 16 G10 – disassembly and upgrade options

Position the workstation on a soft, clean surface to prevent scratches.
Locate the service door latch in the middle of the bottom side and slide it to the right to unlock.
Gently pull upwards on the bottom panel and lift it away from the chassis to reveal the internals.

Tip: This process is designed to be user-friendly, requiring no tools for initial access.

Step 2: Battery Removal

Disconnect the battery connector from the motherboard carefully to avoid damaging any pins.
Remove the five Phillips-head screws securing the 95Wh battery and lift it out of the workstation.

Note: The battery provides substantial usage time, offering up to 16 hours and 40 minutes of web browsing or approximately 12 hours and 30 minutes of video playback.

Memory Upgrade

Access the RAM slots by removing the metal service cover, which is secured by a metal retention bracket and three Phillips-head screws. Note the thermal pads on the inside for cooling.
The workstation supports up to 128GB of DDR5-4800MHz ECC RAM or 128GB of DDR5-5600MHz non-ECC memory in dual-channel mode, with operational speeds depending on the rank of the installed RAM modules.

Upgrade Tip: Enhancing RAM can significantly improve performance, especially for memory-intensive tasks.

You can buy DDR5 RAM modules here: Buy from Amazon.com (#CommissionsEarned)

Storage Upgrade

Locate the four M.2 slots beneath the second metal shroud, which are compatible with 2280 Gen 4 SSDs or Self-Encrypted (SED) OPAL2 units, and are cooled with thermal pads.
Remove the retention covers by undoing two Phillips-head screws for each, to upgrade or add new SSDs.
Don’t forget to check out our Top M.2 SSDs Performance Rankings

You can buy Gen 4 M.2 SSD modules here: Buy from Amazon.com (#CommissionsEarned)

Step 3: Cooling System Overview

The “HP Vaporforce Thermals” system includes a large vapor chamber, metal fans, and thick metal heat pipes for efficient heat management.

Insight: This advanced cooling solution is designed to maintain optimal performance by effectively dissipating heat during intensive computing tasks.