How to open Lenovo Legion Pro 5i (16, Gen 9) – disassembly and upgrade options


Step 1: Accessing the Lenovo Legion Pro 5i (16, Gen 9) Internals

  1. Ensure the Lenovo Legion Pro 5i is powered off and placed on a soft surface to prevent damage.
  2. Remove the 10 Torx-head screws that secure the bottom panel of the laptop.
  3. Begin prying the panel off with a plastic tool from the central zone at the back, then proceed around the sides and the front to fully detach it.


Step 2: Battery Removal

  1. First, disconnect the battery connector from the motherboard to ensure a safe disassembly process.
  2. Remove the 5 Phillips-head screws holding the 80Wh battery, noting that one screw is concealed beneath the metal SSD cover on the left, which also needs to be removed.

More info: The 80Wh battery offers up to 12 hours and 30 minutes of web browsing or 5 hours and 53 minutes of video playback, highlighting impressive battery life for extended use.


Memory Upgrade

  1. Access the RAM slots by popping off the metal plate that covers the RAM area with a lever tool.
  2. The laptop supports up to 32GB of DDR5-5600MHz RAM in dual-channel mode, according to official specs, though the CPU’s compatibility with up to 192GB suggests potential for greater memory capacity.

You can buy DDR5 RAM modules here: Buy from Amazon.com (#CommissionsEarned)


Storage Upgrade

  1. Identify the two M.2 slots suitable for both 2242 and 2280 Gen 4 SSDs, offering versatile storage expansion opportunities.
  2. Note that each slot is safeguarded by a metal shroud, affixed with three Phillips-head screws, and equipped with a thermal pad for improved cooling.

Hint: Consider reviewing our Top M.2 SSDs Performance Rankings to select the best storage solution for your needs.

You can buy Gen 4 M.2 SSD modules here: Buy from Amazon.com (#CommissionsEarned)


Cooling System Overview

  1. The cooling system includes two large fans, multiple heat pipes for efficient heat distribution between the CPU and GPU, and additional pipes dedicated to each component.
  2. Four heat sinks and two extensive metal plates ensure effective heat dissipation, with one plate also serving to cool the chipset.

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